Wire bonding technologies   
 - Al fine wire wedge-wedge bonding 25 um wire
 - Au fine wire wedge-wedge bonding 25 um wire
 - Al heavy wire wedge-wedge bonding 100 um wire
 - Ribbon bonding for high frequency applications

Sealing methods   
 - Epoxy based glob top / dam fil encapsulation
 - Siliocon gel based protection